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  • ATS-17G-151-C2-R0

  • AI
    The **ATS-17G-151-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** line, designed for efficient cooling of electronic chips such as CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 3.93 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Fin Style** | Fine Pitch (XC Cut) | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ## 2. Component Breakdown ### A. The Heat Sink Body The body is made of high-grade aluminum. It uses a **square fin** pattern which increases the surface area significantly, allowing heat to dissipate from the electronic component into the surrounding air more effectively. ### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical fastening system: - **Springs:** Ensure even pressure across the surface of the chip. - **Hardware:** Features brass or plastic pins that lock into pre-drilled holes on the Printed Circuit Board (PCB). ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with a **Phase Change Material (T766)**. This fills microscopic gaps between the chip and the heat sink to ensure maximum heat transfer. --- ## 3. Thermal Performance Comparison Thermal performance is measured by how much the temperature rises per watt of power consumed (°C/W). | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 3.93 °C/W | 2.36 °C/W | | 300 (1.5 m/s) | 2.07 °C/W | 1.62 °C/W | | 500 (2.5 m/s) | 1.63 °C/W | 1.36 °C/W | --- ## 4. Part Number Decoding The part number **ATS-17G-151-C2-R0** can be broken down as follows: - **ATS:** Advanced Thermal Solutions (Manufacturer). - **17G:** Product series/Attachment type. - **151:** Dimensional code (35mm x 35mm x 20mm). - **C2:** Thermal Interface Material type (T766). - **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ Can this heat sink be used for passive cooling without a fan?
    • ⤷ How does the T766 interface material compare to standard thermal paste?