ATS-17G-151-C2-R0
AI

The **ATS-17G-151-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** line, designed for efficient cooling of electronic chips such as CPUs, GPUs, or FPGAs.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance (Unducted)** | 3.93 °C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm |
| **Fin Style** | Fine Pitch (XC Cut) |
| **Interface Material** | T766 (Thermal Tape/Grease) |
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## 2. Component Breakdown
### A. The Heat Sink Body
The body is made of high-grade aluminum. It uses a **square fin** pattern which increases the surface area significantly, allowing heat to dissipate from the electronic component into the surrounding air more effectively.
### B. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a mechanical fastening system:
- **Springs:** Ensure even pressure across the surface of the chip.
- **Hardware:** Features brass or plastic pins that lock into pre-drilled holes on the Printed Circuit Board (PCB).
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates that it comes pre-applied with a **Phase Change Material (T766)**. This fills microscopic gaps between the chip and the heat sink to ensure maximum heat transfer.
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## 3. Thermal Performance Comparison
Thermal performance is measured by how much the temperature rises per watt of power consumed (°C/W).
| Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) |
| :--- | :--- | :--- |
| 100 (0.5 m/s) | 3.93 °C/W | 2.36 °C/W |
| 300 (1.5 m/s) | 2.07 °C/W | 1.62 °C/W |
| 500 (2.5 m/s) | 1.63 °C/W | 1.36 °C/W |
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## 4. Part Number Decoding
The part number **ATS-17G-151-C2-R0** can be broken down as follows:
- **ATS:** Advanced Thermal Solutions (Manufacturer).
- **17G:** Product series/Attachment type.
- **151:** Dimensional code (35mm x 35mm x 20mm).
- **C2:** Thermal Interface Material type (T766).
- **R0:** Revision/Packaging code.
- ⤷
What are the PCB hole requirements for the pushPIN attachment?
- ⤷ Can this heat sink be used for passive cooling without a fan?
- ⤷ How does the T766 interface material compare to standard thermal paste?