The **ATS-17F-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other surface-mount components. --- ### 1. Technical Specifications Below are the primary technical parameters for this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Flow Orientation** | Vertical (Fine Pitch Fins) | | **Thermal Resistance** | ~5.63°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB clearance and component fit: * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 35.00 mm * **Weight:** Information varies, but typical for 40x40mm aluminum extrusions. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it performs vital roles in an electronic assembly: 1. **Heat Dissipation:** It increases the surface area of the heat-generating component (CPU, GPU, or MOSFET), allowing air to carry away heat more efficiently. 2. **Thermal Protection:** By maintaining the junction temperature ($T_j$) within safe limits, it prevents thermal throttling and permanent hardware damage. 3. **Mechanical Stability:** The "Push Pin" system uses a specific hole pattern in the PCB. The springs ensure constant downward pressure on the component, which optimizes the contact with the Thermal Interface Material (TIM). --- ### 4. Part Number Breakdown: `ATS-17F-96-C2-R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **17:** Series identifier. * **F:** Fin style/pitch. * **96:** Specific geometry/sizing code. * **C2:** Thermal Interface Material (TIM) and finish code (Blue Anodized). * **R0:** Revision code. --- ### 5. Application Use Cases This specific heat sink is commonly found in: * **Network Switches/Routers:** Cooling high-speed ASICs. * **Industrial PCs:** Managing heat in fanless or low-airflow environments. * **Power Supplies:** Cooling large transistors or voltage regulators.