The **ATS-17F-95-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-17F-95-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 7.29 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ## 2. Component Analysis ### A. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides surface protection against corrosion and slightly increases emissivity for better radiative cooling. ### B. Thermal Interface Material (TIM) The "C2" suffix in the part number indicates the specific type of thermal interface material used. The **T766** material is pre-applied to the base of the heat sink, ensuring a low-thermal-resistance connection between the heat sink and the electronic chip without requiring additional paste. ### C. Mounting Mechanism This model uses a **Push-Pin and Spring** system: * **Pressure:** The springs provide a consistent, calculated force on the chip to optimize heat transfer. * **Ease of Use:** It allows for quick installation into pre-drilled holes on the PCB (Printed Circuit Board). --- ## 3. Thermal Performance Profile Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 7.29 | | **400 (2.0 m/s)** | 3.87 | | **600 (3.0 m/s)** | 3.06 | --- ## 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Electronics:** Cooling for MOSFETs or high-speed voltage regulators.