The **ATS-17F-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 16.48°C/W (Unducted) | | **Airflow Path** | Horizontal (Straight Fin) | --- ### 2. Key Features and Design #### A. pushPIN™ Attachment One of the defining "electronic parts" of this assembly is the **pushPIN™** system. Unlike simple adhesive tapes, this uses: * **Compression Springs:** Provides precise, uniform pressure across the component surface for maximum heat transfer. * **Plastic/Brass Pins:** Securely locks the heat sink into pre-drilled holes on the Printed Circuit Board (PCB). #### B. Straight Fin Design The "92" series features a **Straight Fin** geometry. This design is optimized for environments where there is a consistent, directed airflow (ducted or fan-driven). The spacing between the fins is engineered to minimize pressure drop while maximizing surface area. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodize:** This isn't just aesthetic; the anodized coating increases emissivity and protects the aluminum from environmental corrosion. --- ### 3. Application Use Cases This part is typically found in high-reliability electronic assemblies such as: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Industrial Embedded Systems:** Where vibration resistance (provided by the push-pins) is required. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air passing through the fins: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 16.48 | | 300 | 1.5 | 6.64 | | 500 | 2.5 | 4.24 |