The **ATS-17F-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling processors and other high-heat surface-mount components. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 10.00mm | | **Fin Style** | Straight | | **Thermal Resistance** | 21.97°C/W (at natural convection) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Components The part is engineered to maximize surface area within a small footprint to dissipate heat from electronic chips. * **Fins:** The straight-fin design allows for efficient airflow, particularly in forced-air environments (using fans). * **Attachment Mechanism:** It uses a **Push-Pin** system with a compression spring. This ensures consistent pressure on the component, improving thermal conductivity while being easy to install on a PCB. * **Thermal Interface Material (TIM):** It comes with pre-applied **T766** phase-change material, which eliminates the need for manual thermal paste application and ensures a bubble-free contact between the chip and the aluminum base. --- ### 3. Common Applications This heat sink is typically found in hardware where space is limited but heat dissipation is critical: 1. **Network Switches/Routers:** Cooling ASICs and high-speed processing units. 2. **Embedded Systems:** Industrial PCs or single-board computers. 3. **Power Supplies:** Managing heat for voltage regulators or power transistors. --- ### 4. Thermal Performance Comparison Thermal performance varies significantly based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Natural Convection** | 21.97 | | **200 LFM** | 10.19 | | **400 LFM** | 6.59 | | **600 LFM** | 5.20 |