The **ATS-17F-89-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance heat sink product line, specifically the **maxiFLOW™** series. Below is a detailed breakdown of its electronic and mechanical specifications. ### 1. Component Overview This part is a high-performance heat sink designed for cooling electronic components such as CPUs, GPUs, FPGAs, or ASICs that generate significant heat during operation. | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-17F-89-C2-R0 | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Body) / Copper (optional base variants) | | **Finish** | Blue Anodized | --- ### 2. Thermal Performance Data The "C2" in the part number typically refers to the thermal interface material (TIM) or the specific coating. Thermal performance is measured by thermal resistance ($^\circ\text{C/W}$), where a lower number indicates better cooling. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | **200 (1.0 m/s)** | 3.94 $^\circ\text{C/W}$ | 2.30 $^\circ\text{C/W}$ | | **400 (2.0 m/s)** | 2.20 $^\circ\text{C/W}$ | 1.60 $^\circ\text{C/W}$ | | **600 (3.0 m/s)** | 1.70 $^\circ\text{C/W}$ | 1.30 $^\circ\text{C/W}$ | --- ### 3. Physical Dimensions The physical footprint is critical for PCB layout and ensuring no interference with surrounding components (capacitors, inductors, etc.). * **Length (A):** 35.00 mm * **Width (B):** 35.00 mm * **Height (C):** 30.00 mm * **Pitch (E/F):** 40.00 mm (Distance between mounting holes) --- ### 4. Key Electronic/Mechanical Features * **pushPIN™ Attachment:** The "R0" designation refers to the mounting kit. This system uses a flexible, spring-loaded mechanism that provides consistent pressure to the processor, improving thermal contact. * **High Aspect Ratio Fins:** The maxiFLOW™ design features a graduated fin pattern that maximizes surface area for heat dissipation while minimizing pressure drop (airflow resistance). * **Thermal Interface Material (TIM):** This part usually comes pre-applied with a high-conductivity thermal phase-change material or grease to bridge the microscopic gaps between the heat sink and the chip. * **EMI Shielding Compatibility:** The design allows for airflow without significantly impacting the electromagnetic interference profiles of high-speed electronic boards. --- ### 5. Application Example ```python # Conceptual Thermal Calculation heat_generated_by_chip = 15.0 # Watts ambient_temperature = 25.0 # Celsius thermal_resistance = 2.20 # C/W at 400 LFM # Calculate estimated chip temperature chip_temp = ambient_temperature + (heat_generated_by_chip * thermal_resistance) print(f"Estimated Chip Operating Temperature: {chip_temp} C") # Result: 58.0 C ```