### Technical Overview: ATS-17F-84-C2-R0 The **ATS-17F-84-C2-R0** is a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Key Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Blue Anodized (Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (LxW)** | 30.00 mm x 30.00 mm | | **Height** | 35.00 mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 7.00 °C/W (@ 100 LFM) | | **Mounting Hole Pattern** | 35.00 mm x 35.00 mm | --- ### 2. Physical Design & Construction * **Fin Configuration:** It features a "Straight Fin" design. This is optimized for **undirected airflow**, allowing air to pass through the channels easily to dissipate heat. * **Material Efficiency:** The aluminum construction offers a balance between lightweight design and high thermal conductivity. The Blue Anodized finish protects against corrosion and increases surface emissivity. * **Attachment Mechanism:** It uses the **pushPIN™** system, which involves a brass or plastic pin and a high-tension spring. This ensures a consistent "Interface Pressure" against the electronic chip for maximum heat transfer. --- ### 3. Performance Factors The efficiency of the ATS-17F-84-C2-R0 is measured by its **Thermal Resistance**. As airflow increases, the resistance drops, allowing for better cooling: * **@ 100 LFM (Linear Feet per Minute):** 7.00 °C/W * **@ 300 LFM:** 2.85 °C/W * **@ 700 LFM:** 1.80 °C/W --- ### 4. Part Number Breakdown (Nomenclature) `ATS - 17 - F - 84 - C2 - R0` | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **17** | Part Series/Sequence | | **F** | Fin Pitch/Pattern (Straight Fin) | | **84** | Specific physical dimensions/iteration | | **C2** | Thermal Interface Material (T412 - Phase Change Material) | | **R0** | Revision code/Packaging code | --- ### 5. Application Usage This heat sink is typically used in: * **Embedded Systems:** Industrial PCs where space is tight but vertical height (35mm) is available. * **Telecommunications:** Cooling of high-speed networking chips. * **Power Supplies:** To dissipate heat from MOSFETs or voltage regulators.