ATS-17F-83-C2-R0
AI

The **ATS-17F-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series designed for cooling integrated circuits (ICs) and other electronic components.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance (Unducted)** | 1.62 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 0.94 °C/W @ 100 LFM |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Components & Design Features
#### A. The Fin Profile
The "83" in the part number designates the specific fin pattern. This model uses a **straight-fin** configuration. This design is optimized for environments where there is a consistent, directional airflow (forced convection), providing low pressure drop and efficient heat dissipation.
#### B. The pushPIN™ Attachment System
Instead of using adhesive tapes or simple clips, this part utilizes a **pushPIN™** mechanism:
- **Flexible Mounting:** It uses a brass or plastic pin with a high-performance compression spring.
- **Reliable Pressure:** It ensures constant, even pressure on the processor, which maximizes the efficiency of the Thermal Interface Material (TIM).
- **Hole Pattern:** It requires a standard 2-hole mounting pattern on the PCB (usually 35mm pitch for this size).
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base.
- **Purpose:** It fills microscopic air gaps between the heat source (the chip) and the heat sink base.
- **Benefit:** Pre-application ensures a consistent layer thickness, reducing the risk of overheating due to poor manual application.
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### 3. Part Number Breakdown
The nomenclature follows a specific logic:
- **ATS:** Manufacturer (Advanced Thermal Solutions)
- **17:** Series identifier
- **F:** Fin type (Straight/Cross-cut variants)
- **83:** Specific dimensions and fin density code
- **C2:** Material/Color code (Aluminum, Blue Anodized)
- **R0:** Revision/Packaging code
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### 4. Application Use Cases
* **Networking Equipment:** Switches and routers where high-density chips generate significant heat.
* **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is needed via the pushPIN system.
* **Power Supplies:** Cooling MOSFETs or power regulators in a compact 30x30mm footprint.
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What are the PCB hole requirements for mounting this heat sink?
- ⤷ How does the T766 thermal material compare to standard thermal grease?
- ⤷ Can this heat sink be used in natural convection environments without fans?