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  • ATS-17F-83-C2-R0

  • AI
    The **ATS-17F-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance (Unducted)** | 1.62 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 0.94 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. The Fin Profile The "83" in the part number designates the specific fin pattern. This model uses a **straight-fin** configuration. This design is optimized for environments where there is a consistent, directional airflow (forced convection), providing low pressure drop and efficient heat dissipation. #### B. The pushPIN™ Attachment System Instead of using adhesive tapes or simple clips, this part utilizes a **pushPIN™** mechanism: - **Flexible Mounting:** It uses a brass or plastic pin with a high-performance compression spring. - **Reliable Pressure:** It ensures constant, even pressure on the processor, which maximizes the efficiency of the Thermal Interface Material (TIM). - **Hole Pattern:** It requires a standard 2-hole mounting pattern on the PCB (usually 35mm pitch for this size). #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. - **Purpose:** It fills microscopic air gaps between the heat source (the chip) and the heat sink base. - **Benefit:** Pre-application ensures a consistent layer thickness, reducing the risk of overheating due to poor manual application. --- ### 3. Part Number Breakdown The nomenclature follows a specific logic: - **ATS:** Manufacturer (Advanced Thermal Solutions) - **17:** Series identifier - **F:** Fin type (Straight/Cross-cut variants) - **83:** Specific dimensions and fin density code - **C2:** Material/Color code (Aluminum, Blue Anodized) - **R0:** Revision/Packaging code --- ### 4. Application Use Cases * **Networking Equipment:** Switches and routers where high-density chips generate significant heat. * **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is needed via the pushPIN system. * **Power Supplies:** Cooling MOSFETs or power regulators in a compact 30x30mm footprint.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting this heat sink?
    • ⤷ How does the T766 thermal material compare to standard thermal grease?
    • ⤷ Can this heat sink be used in natural convection environments without fans?