ATS-17F-70-C2-R0
AI

The part number **ATS-17F-70-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 8.69° C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
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### 2. Breakdown of the Part Number
The alphanumeric code follows a specific naming convention:
- **ATS**: Manufacturer (Advanced Thermal Solutions).
- **17**: Refers to the specific series/fin pattern.
- **F**: Indicates a "Fine" pitch or specific fin density.
- **70**: Dimensional code (correlating to the 45mm square footprint).
- **C2**: Material/Finish code (Blue Anodized Aluminum).
- **R0**: Revision or packaging indicator.
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### 3. Key Components & Design Features
#### A. Fin Design (Straight Fin)
The unit features a straight-fin design. This is optimized for **forced air convection** (using a fan). The vertical fins provide a large surface area to dissipate heat away from the semiconductor.
#### B. Push-Pin Mounting
Instead of using adhesive tape which can fail under high heat, this model uses **brass push-pins** with integrated springs.
- **Benefit:** Provides consistent pressure (clamping force) against the chip for better thermal transfer.
- **Requirement:** Requires pre-drilled holes in the Printed Circuit Board (PCB).
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base.
- This is a "Phase Change" or high-performance pad that fills microscopic air gaps between the heatsink and the electronic component, significantly reducing thermal resistance.
#### D. Blue Anodized Finish
The blue coating is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion.
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### 4. Typical Applications
This heatsink is generally found in:
* **Telecommunications:** Cooling high-speed networking chips.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or power ICs.
- ⤷
What are the PCB hole size requirements for the brass push-pins on this model?
- ⤷ How does the thermal resistance change as the airflow (LFM) increases?
- ⤷ Is there a version of this heatsink with a different height for low-profile applications?