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  • ATS-17F-70-C2-R0

  • AI
    The part number **ATS-17F-70-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 8.69° C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention: - **ATS**: Manufacturer (Advanced Thermal Solutions). - **17**: Refers to the specific series/fin pattern. - **F**: Indicates a "Fine" pitch or specific fin density. - **70**: Dimensional code (correlating to the 45mm square footprint). - **C2**: Material/Finish code (Blue Anodized Aluminum). - **R0**: Revision or packaging indicator. --- ### 3. Key Components & Design Features #### A. Fin Design (Straight Fin) The unit features a straight-fin design. This is optimized for **forced air convection** (using a fan). The vertical fins provide a large surface area to dissipate heat away from the semiconductor. #### B. Push-Pin Mounting Instead of using adhesive tape which can fail under high heat, this model uses **brass push-pins** with integrated springs. - **Benefit:** Provides consistent pressure (clamping force) against the chip for better thermal transfer. - **Requirement:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. - This is a "Phase Change" or high-performance pad that fills microscopic air gaps between the heatsink and the electronic component, significantly reducing thermal resistance. #### D. Blue Anodized Finish The blue coating is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. --- ### 4. Typical Applications This heatsink is generally found in: * **Telecommunications:** Cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power ICs.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole size requirements for the brass push-pins on this model?
    • ⤷ How does the thermal resistance change as the airflow (LFM) increases?
    • ⤷ Is there a version of this heatsink with a different height for low-profile applications?