The **ATS-17F-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The part number provides specific data regarding the dimensions, thermal resistance, and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Mounting Style** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 35mm x 35mm x 15mm | | **Thermal Resistance** | 19.03°C/W (at 100 LFM) | | **Fin Style** | XC-Cut (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of Components #### A. The Heat Sink Body * **XC-Cut Design:** The "XC" or cross-cut fin pattern allows for airflow from any direction (omnidirectional). This is ideal for enclosures where airflow patterns might be irregular. * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and increases surface emissivity, which slightly improves radiant cooling. #### B. The Attachment Mechanism (Push-Pin) * **Brass Push-Pins:** These provide a secure, standardized attachment to the PCB. They are more reliable than adhesive tapes in high-vibration environments. * **Compression Springs:** These ensure constant pressure (clamping force) between the heat sink and the electronic component (e.g., a BGA chip or MOSFET), which is critical for maximizing heat transfer. #### C. Thermal Interface Material (TIM) * **T766:** The unit comes with a pre-applied phase-change material or thermal pad. This fills the microscopic air gaps between the heat source and the heat sink base, significantly reducing thermal impedance. --- ### 3. Thermal Performance Profile Thermal resistance (measured in °C/W) indicates how many degrees Celsius the component temperature will rise for every watt of power dissipated. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural Convection) | 19.03 | | 200 (Low Flow) | 7.15 | | 400 (Moderate Flow) | 4.36 | | 600 (High Flow) | 3.43 | --- ### 4. Applications The ATS-17F-50-C2-R0 is commonly used to cool: * **BGA (Ball Grid Array) Components:** Such as Processors, FPGAs, and ASICs. * **Telecommunications Equipment:** High-density boards where airflow is restricted. * **Industrial Power Supplies:** Where mechanical stability (via push-pins) is required.