The **ATS-17F-49-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** push-pin heat sink. It is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Fin Type** | XC-Cut (Cross-Cut) | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Thermal Resistance** | ~5.41°C/W (at 200 LFM) | | **Dimensions** | 25mm x 25mm x 20mm | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body * **XC-Cut Geometry:** The fins are cut in a grid-like pattern. This allows for multi-directional airflow, making it highly effective in systems where the cooling fan might be offset or where airflow direction is inconsistent. * **Blue Anodized Coating:** The blue finish is not just aesthetic; anodizing increases surface emissivity, which helps in radiating heat and protects the aluminum from corrosion. #### B. The Push-Pin Mechanism * **Attachment:** Instead of using messy thermal adhesives or tapes, this part uses **brass push-pins**. * **Compression Springs:** The springs ensure a consistent and high-pressure contact between the heat sink and the component, which is critical for reducing thermal interface resistance. #### C. Thermal Interface Material (TIM) * **Pre-Applied Material:** These units usually come with a pre-applied phase-change material or a high-performance thermal pad (specifically **T766** in the R0 series), ensuring optimal heat transfer from the chip to the aluminum. --- ### 3. Applications This specific size (25mm) and height (20mm) is commonly used in: * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling voltage regulators and MOSFETs. --- ### 4. Thermal Performance Comparison Below is an approximation of how air velocity (LFM - Linear Feet per Minute) affects the thermal resistance of this part: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 11.82 | | **200 LFM** | 5.41 | | **400 LFM** | 4.22 | | **600 LFM** | 3.59 | ---