The **ATS-17F-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Product Series** | pushPIN™ | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 30.0mm | | **Thermal Resistance** | 3.95° C/W (@ 100 LFM) | --- ### 2. Key Component Features #### A. pushPIN™ Attachment System This part utilizes a standardized push-pin system. This is critical for electronic assemblies because: * It ensures consistent **Contact Pressure** between the heat sink and the chip. * It allows for rapid assembly and reduces the risk of damaging the PCB during installation. #### B. Cross-Cut Fin Design The "F" in the part number refers to the fin geometry. This heat sink uses a cross-cut pattern, which: * Increases surface area for heat radiation. * Supports **Omni-directional airflow**, meaning it works efficiently regardless of which direction the fan is blowing. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766** thermal phase change material. * **Purpose:** To fill microscopic air gaps between the component and the heat sink base. * **Effect:** Significantly lowers the thermal impedance, allowing heat to flow more freely into the aluminum fins. --- ### 3. Decoding the Part Number The part number follows a specific nomenclature used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **17** | Series Identifier | | **F** | Fine Pitch / Fin Geometry | | **47** | Size/Specific Model Reference | | **C2** | Thermal Performance Level / Blue Anodized Finish | | **R0** | Revision or RoHS Compliance status | --- ### 4. Applications in Electronics * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Cooling chips on routers and switches. * **Power Supplies:** Managing heat for MOSFETs or voltage regulators in dense PCB layouts.