The **ATS-17F-40-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed for thermal management in electronic systems, primarily to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimension (L x W)** | 45mm x 45mm | | **Height (H)** | 15mm | | **Thermal Resistance** | ~1.50 °C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. Fin Pattern (Cross-Cut) The ATS-17F-40-C2-R0 features a **fine-pitch cross-cut fin design**. This structure increases the surface area for heat dissipation and allows for omnidirectional airflow, meaning the cooling efficiency remains high regardless of which direction the air flows from the system fan. #### B. Push-Pin Attachment Instead of using messy adhesives or thermal tape, this part uses the **pushPIN™** system. * **Compression Spring:** Ensures precise pressure is applied to the component, optimizing thermal transfer. * **Reliability:** It prevents the heat sink from shifting during shipping or high-vibration environments. #### C. Thermal Interface Material (TIM) The heat sink comes with **T766** pre-applied to the base. * **Function:** It fills the microscopic air gaps between the heat sink and the electronic chip. * **Advantage:** Eliminates the need for manual thermal paste application, reducing assembly time and errors. --- ### 3. Application Use Cases This specific part is typically found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** For industrial PCs where space (15mm height) is limited. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Thermal resistance depends on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 14.56 (Unducted) | | 200 | 1.0 | 5.43 | | 400 | 2.0 | 2.50 | | 600 | 3.0 | 1.72 |