The **ATS-17F-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its dimensions and thermal properties. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height (H)** | 25.00 mm | | **Pitch** | Fine Pitch (High-density fins) | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive tapes that can fail under high heat, this part uses a mechanical **pushPIN™** system. It consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide specific pressure to ensure maximum surface contact between the heat sink and the electronic chip. ### B. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heat sink comes with a pre-applied **Thermal Interface Material**. This fills the microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. ### C. Fin Design The part utilizes a high-performance **cross-cut** or **straight fin** geometry (depending on the specific sub-batch). This design is optimized for forced air cooling (fans), allowing air to flow through the fins and carry away heat efficiently. --- ## 3. Application Use Cases This specific size (35mm x 35mm x 25mm) is commonly used in: 1. **Telecommunications:** Cooling of high-speed network processors. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or Voltage Regulator Modules (VRMs). --- ## 4. Thermal Performance * **Thermal Resistance:** This indicates how many degrees Celsius the temperature will rise per watt of power dissipated ($^\circ C/W$). * **Airflow Dependency:** Because of the dense fin structure, this part performs significantly better in an active cooling environment (where a fan is present) compared to passive (natural convection) cooling.