The **ATS-17F-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series designed for securing cooling solutions to Integrated Circuits (ICs) and other electronic components. --- ### ## Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Brass, Tin-plated) | | **Thermal Resistance** | 2.51°C/W (at 200 LFM) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (H)** | 12.70 mm | | **Mounting Hole Pitch** | 47.00 mm | --- ### ## Core Electronic Components The "Electronic Parts" of this assembly are not active circuits, but rather the **mechanical hardware** required for thermal coupling to an electronic PCB: 1. **Heat Sink Body (Aluminum 6063):** * Designed with a **Fine Pitch** fin pattern. This maximizes surface area for heat dissipation in high-airflow environments. * The Blue Anodized finish protects against corrosion and improves thermal emissivity. 2. **Push-pin Mechanism:** * Made of **Brass** with a **Tin** finish. * These pins provide a specific, pre-calculated compression force to ensure the heat sink remains in contact with the CPU/GPU/ASIC. 3. **Spring (AISI 302 Stainless Steel):** * The compression springs provide uniform pressure across the Thermal Interface Material (TIM). This prevents "tilting" of the heat sink which could damage the die. 4. **Thermal Interface Material (TIM):** * The "C2" in the part number indicates it comes pre-applied with **ATS-PPS-02** (a high-performance thermal grease or pad). --- ### ## Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (m/s) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 0.5 | 100 | 4.03 | | 1.0 | 200 | 2.51 | | 1.5 | 300 | 2.02 | | 2.0 | 400 | 1.77 | --- ### ## Application Use Cases * **Networking Switches/Routers:** Cooling high-speed ASICs. * **Industrial PCs:** Maintaining stability in high-ambient temperature environments. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators.