The **ATS-17F-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). --- ## 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | XCUT (Cross-Cut) | | **Dimensions** | 70mm x 70mm x 25mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 0.88°C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ## 2. Key Design Components ### A. Fin Geometry (XCUT) The "XCUT" design features a grid of individual pins or "cross-cut" fins. * **Omnidirectional Airflow:** Unlike straight-fin heat sinks that require air to flow in one specific direction, cross-cut fins allow air to enter from any angle, making it ideal for crowded PCB environments. * **Surface Area:** The design maximizes the surface-to-volume ratio to improve heat dissipation. ### B. Attachment Mechanism (Push-Pin) * **Hardware:** It utilizes a brass push-pin with a compression spring. * **Installation:** The pins snap into pre-drilled holes in the PCB. This provides a consistent, high-pressure contact between the heat sink and the electronic component (CPU, FPGA, or GPU), which is critical for efficient heat transfer. ### C. Thermal Interface Material (T766) * The base comes pre-applied with **ATS-T766** phase-change material. * This eliminates the need for manual application of thermal paste and ensures there are no microscopic air gaps between the component and the heat sink. --- ## 3. Thermal Performance Profile The efficiency of the ATS-17F-30-C2-R0 depends heavily on the airflow (Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 0.88 | | 300 (1.5 m/s) | 0.59 | | 400 (2.0 m/s) | 0.48 | | 500 (2.5 m/s) | 0.42 | --- ## 4. Typical Applications This heat sink is commonly used for cooling large, high-heat-generating integrated circuits, such as: * **High-end Network Switches/Routers** * **Telecommunications Equipment** * **Server Motherboards** * **Industrial Power Supplies**