The **ATS-17F-210-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-17F-210-C2-R0 | | **Dimensions (L x W x H)** | 70.00 mm x 70.00 mm x 12.00 mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.18°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | XC-CUT (Cross-cut) | --- ### 2. Key Electronic Features #### A. Attachment Mechanism: pushPIN™ This part utilizes a spring-loaded "pushPIN" system. This is critical for electronics because it ensures: * **Uniform Pressure:** Prevents cracking the silicon die of a processor or BGA package. * **Easy Installation:** Replaces messy adhesives with a mechanical connection using pre-drilled holes in the PCB. * **Reliability:** Maintains a consistent thermal interface under vibration or thermal expansion. #### B. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the heat sink and the electronic component, significantly lowering thermal resistance. #### C. Fin Design (XC-CUT) The "XC-CUT" refers to the cross-cut fin geometry. This design is optimized for: * **Multi-directional Airflow:** It works efficiently regardless of which direction the cooling fan is blowing. * **Low Profile:** At only 12mm high, it is ideal for space-constrained electronic enclosures (like 1U servers or slim networking gear). --- ### 3. Typical Applications In an electronic system, this heat sink is typically found cooling: * **ASICs and FPGAs:** High-gate-count chips that generate significant heat. * **Processors:** Low-to-mid range CPUs in industrial applications. * **Power Modules:** Large VRMs (Voltage Regulator Modules) or power converters.