The **ATS-17F-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling integrated circuits (ICs) and high-power electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Specification | Details | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight | | **Fin Pattern** | XCUT (Cross-cut) | | **Thermal Resistance (Flowing)** | 6.70 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.24 °C/W @ 700 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical push-pin system. - **Component Safety:** Ensures a secure fit that does not degrade over time due to heat. - **Spring Tension:** Provides consistent pressure (Pre-assembled with a 27.0mm spring) to ensure optimal contact with the electronic chip. ### B. XCUT Fin Design The "XCUT" geometry is an advanced fin pattern that allows for: - **Multidirectional Airflow:** Highly effective in environments where the direction of the cooling fan's airflow may vary. - **Surface Area Optimization:** Increases the "wetted" surface area to dissipate heat from the silicon die more efficiently. ### C. Thermal Interface Material (TIM) The "R0" suffix indicates that this part typically comes with **T766** thermal interface material pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink. --- ## 3. Applications This part is commonly used in high-density electronic assemblies such as: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Industrial Control Systems:** Managing thermals for power MOSFETs or IGBTs. 3. **Embedded Systems:** Where space is limited but high vertical clearance (30mm) is available for cooling. --- ## 4. Engineering Dimensions Reference ```json { "Part_Number": "ATS-17F-101-C2-R0", "Dimensions_mm": { "A": 45.00, "B": 45.00, "C": 30.00, "E": 38.00, "F": 38.00 }, "Pitch": "Fine-Pitch" } ```