The **ATS-17F-08-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications This part belongs to the **maxiFLOW™** series, which is characterized by its high-aspect-ratio fin design. | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | ~4.76°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal properties of the unit: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17F**: Refers to the specific fin pattern and series (maxiFLOW). * **08**: Internal size/category code for dimensions. * **C2**: Indicates the material and finish (typically aluminum with a blue anodized coating). * **R0**: Version/Revision code. --- ### 3. Key Electronic/Thermal Features #### A. Fin Geometry (maxiFLOW™) The "F" in the part number indicates a flared fin design. These fins spread outward, which maximizes the surface area for heat dissipation while maintaining a low pressure drop. This is crucial in electronics where airflow is limited. #### B. pushPIN™ Attachment Unlike simple adhesive tapes, the **pushPIN™** system uses a flexible, spring-loaded mechanism. * **Purpose:** It ensures a specific amount of pressure is applied between the heat sink and the electronic chip. * **Benefit:** Provides a more reliable thermal connection and prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills the microscopic air gaps between the chip surface and the heat sink base. * **Benefit:** Dramatically reduces thermal impedance, allowing heat to flow efficiently out of the semiconductor. --- ### 4. Typical Applications This component is used in environments where heat management is critical for electronic longevity: * **Networking:** Routers, switches, and high-speed modems. * **Industrial PC:** Embedded systems and compact servers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.