The part number **ATS-17F-06-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "maxiFLOW™" product family, specifically designed for cooling high-power electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 2.03°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45.00mm x 40.00mm | | **Height** | 25.00mm | | **Mounting Pattern** | 38.00mm (Center to Center) | --- ## 2. Key Electronic & Mechanical Features ### A. maxiFLOW™ Design The heat sink features a tapered fin structure. Unlike standard parallel fins, the maxiFLOW design maximizes the surface area for radiant cooling while minimizing the pressure drop. This is crucial for dense PCB layouts where airflow is restricted. ### B. pushPIN™ Attachment System This part utilizes a specific mounting mechanism: * **Compression Springs:** Provides a precise and consistent downward pressure on the component (e.g., a CPU, FPGA, or BGA). * **Plastic/Brass Pins:** The "R0" suffix indicates a specific pin type designed to fit into pre-drilled holes in the PCB, ensuring the heat sink does not shift during vibration or shipping. ### C. Thermal Interface Material (TIM) The part typically comes with a **Phase Change Material (PCM)** or high-performance thermal pad pre-applied to the base. This ensures there are no air gaps between the electronic component and the aluminum base, maximizing heat transfer. --- ## 3. Application Use Cases This component is generally used to cool high-heat-generating semiconductors in the following fields: * **Telecommunications:** Base stations and networking switches. * **Industrial Power:** Motor drives and power supply units. * **Data Centers:** Cooling of logic chips on server blades. ---