The **ATS-17F-05-C2-R0** is a specific electronic cooling component, categorized as a high-performance **Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to their "push pin" series. Below is a detailed breakdown of its specifications and electronic/mechanical properties. --- ### 1. General Specifications The ATS-17F-05-C2-R0 is designed for cooling electronic components such as CPUs, GPUs, or power transistors that require efficient heat dissipation in a compact form factor. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 11.54°C/W (Unducted Flow @ 200 LFM) | --- ### 2. Physical Design & Dimensions The physical geometry of the heat sink determines how effectively it transfers heat from the silicon die to the surrounding air. * **Height (25mm):** The "05" in the part number indicates a specific profile height (25mm). This is considered a medium-profile heat sink, suitable for 1U or 2U chassis. * **Base Dimensions (40mm x 40mm):** Matches standard BGA (Ball Grid Array) or FPGA footprints. * **Fin Style:** It utilizes a **Fine Pitch Cross-Cut** pattern. This creates a large surface area and allows for airflow from multiple directions, which is critical for systems with varying fan orientations. --- ### 3. Thermal Performance (Electronic Cooling) In electronics, thermal management is measured by Thermal Resistance ($R_{th}$). Lower values indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 11.54 | | 400 (2.0 m/s) | 4.37 | | 600 (3.0 m/s) | 2.97 | *Note: At higher air speeds, the cooling efficiency increases significantly.* --- ### 4. Mounting & Interface The **C2-R0** suffix provides information about the finish and the mounting hardware: * **Push Pin (Brass/Plastic):** The assembly uses a spring-loaded push pin system. This ensures a consistent "Normal Force" is applied to the electronic component, preventing the heat sink from shifting and ensuring optimal contact with the Thermal Interface Material (TIM). * **C2:** Refers to the **Blue Anodized** finish, which provides corrosion resistance and a slight increase in emissivity for radiant cooling. * **R0:** Indicates compliance with standard industry environmental regulations (RoHS). --- ### 5. Application Context This part is typically used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulator modules (VRMs).