The **ATS-17D-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal properties. | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Push-Pin) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 30mm | | **Fin Style** | Straight | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 6.67°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material** | T766 (High Performance) | --- ### 2. Physical Design Features The construction of this part is optimized for airflow and ease of assembly: * **Heat Sink Profile:** The 30mm height provides a significant surface area for cooling without a massive footprint, making it ideal for medium-profile server or industrial enclosures. * **Fin Configuration:** The straight-fin design is optimized for environments with forced-air cooling (fans). * **Push-Pin Attachment:** This model uses a spring-loaded push-pin mechanism. This provides a consistent, high-pressure contact between the heat sink and the electronic component, which is crucial for efficient heat transfer. * **Blue Anodized Finish:** The anodized coating not only protects the aluminum from oxidation but also improves radiation heat transfer. --- ### 3. Application Use Cases This specific part is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of networking processors and ASICs. 2. **Embedded Systems:** High-power industrial computers. 3. **Power Electronics:** Dissipating heat from high-current voltage regulators or power modules. ### 4. Mounting Diagram Logic The attachment method is designed for a PCB with pre-drilled holes. ```markdown [ Push-Pin ] [ Heat Sink ] [ Push-Pin ] | | | | | | ___|_|_________________|_|_________________|_|___ | | | ALUMINUM HEAT SINK BODY | |_________________________________________________| | | | | [ Spring ] [ Spring ] ------------------------------------------------------- [ PCB / MOTHERBOARD ] ``` ---