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  • ATS-17B-89-C2-R0

  • AI
    The **ATS-17B-89-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series. --- ### 1. Technical Specifications The part is designed for high-performance thermal management of electronic components such as BGA (Ball Grid Array) processors. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-17B-89-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.94°C/W (at 100 LFM) | | **Flow Direction** | Rectangular / Straight Fin | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by ATS to identify the physical and thermal properties of the unit. - **ATS**: Manufacturer (Advanced Thermal Solutions). - **17B**: Specific series identification within the product line. - **89**: Heat sink profile or geometric design identifier. - **C2**: Indicates the material and finish (usually T766 thermal interface material and Blue Anodized finish). - **R0**: Revision/Packaging code. --- ### 3. Key Electronic Cooling Functions The ATS-17B-89-C2-R0 serves several critical functions in an electronic assembly: 1. **Thermal Dissipation**: It increases the surface area of a hot component (like a CPU, GPU, or FPGA), allowing heat to transfer into the ambient air more efficiently. 2. **Spring-Loaded Attachment**: The **pushPIN™** mechanism ensures constant, even pressure across the thermal interface material (TIM). This prevents gaps that can lead to overheating. 3. **Low Profile Design**: With a height of 20mm, it is suitable for compact electronic enclosures where vertical space is limited. 4. **Optimal Airflow**: The straight-fin design is optimized for systems with a clear directional air path provided by internal chassis fans. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air moving across the fins (measured in Linear Feet per Minute - LFM): * **@100 LFM (0.5 m/s):** 7.94 °C/W * **@300 LFM (1.5 m/s):** 3.64 °C/W * **@500 LFM (2.5 m/s):** 2.68 °C/W
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole requirements for the pushPIN system used in this part?
    • ⤷ How does the Blue Anodized finish affect the thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?