ATS-17B-89-C2-R0
AI

The **ATS-17B-89-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series.
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### 1. Technical Specifications
The part is designed for high-performance thermal management of electronic components such as BGA (Ball Grid Array) processors.
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-17B-89-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 7.94°C/W (at 100 LFM) |
| **Flow Direction** | Rectangular / Straight Fin |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm |
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### 2. Breakdown of the Part Number
The alphanumeric code follows a specific naming convention used by ATS to identify the physical and thermal properties of the unit.
- **ATS**: Manufacturer (Advanced Thermal Solutions).
- **17B**: Specific series identification within the product line.
- **89**: Heat sink profile or geometric design identifier.
- **C2**: Indicates the material and finish (usually T766 thermal interface material and Blue Anodized finish).
- **R0**: Revision/Packaging code.
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### 3. Key Electronic Cooling Functions
The ATS-17B-89-C2-R0 serves several critical functions in an electronic assembly:
1. **Thermal Dissipation**: It increases the surface area of a hot component (like a CPU, GPU, or FPGA), allowing heat to transfer into the ambient air more efficiently.
2. **Spring-Loaded Attachment**: The **pushPIN™** mechanism ensures constant, even pressure across the thermal interface material (TIM). This prevents gaps that can lead to overheating.
3. **Low Profile Design**: With a height of 20mm, it is suitable for compact electronic enclosures where vertical space is limited.
4. **Optimal Airflow**: The straight-fin design is optimized for systems with a clear directional air path provided by internal chassis fans.
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### 4. Thermal Performance Data
Performance varies based on the velocity of the air moving across the fins (measured in Linear Feet per Minute - LFM):
* **@100 LFM (0.5 m/s):** 7.94 °C/W
* **@300 LFM (1.5 m/s):** 3.64 °C/W
* **@500 LFM (2.5 m/s):** 2.68 °C/W
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What are the mounting hole requirements for the pushPIN system used in this part?
- ⤷ How does the Blue Anodized finish affect the thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?