The **ATS-17B-76-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary technical parameters for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance** | 11.57°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 15.00mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Physical Design Features The ATS-17B-76-C2-R0 is engineered for specific airflow conditions: * **Fin Pattern:** It uses a **Fine Pitch** fin design. This increases the surface area for heat dissipation, making it highly effective in environments with forced air (fans). * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This ensures a consistent pressure (compression) against the chip, improving heat transfer efficiency. * **Aluminum Construction:** Aluminum is chosen for its excellent thermal conductivity-to-weight ratio, ensuring the component doesn't add excessive mass to the PCB. --- ### 3. Applications and Usage This part is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed data processing chips in routers and switches. 2. **Embedded Systems:** Protecting microprocessors in industrial controllers. 3. **Power Electronics:** Managing heat for voltage regulators or small MOSFET arrays. 4. **Consumer Electronics:** Used on GPUs or specialized ASICs where space is constrained but thermal loads are high. --- ### 4. Thermal Performance Comparison The efficiency of the heat sink changes based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 11.57 | | 300 | 1.5 | 4.42 | | 500 | 2.5 | 3.17 | | 700 | 3.5 | 2.61 | ---