The **ATS-17B-75-C3-R0** is a specific electronic cooling component known as a **Heat Sink**. It is part of the "Advanced Thermal Solutions" (ATS) product line, specifically designed for high-performance thermal management in electronic circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature. Here are the core specifications for this unit: | Parameter | Specification | | :--- | :--- | | **Component Type** | Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 25mm x 25mm x 30mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | ~5.20° C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T412 (Double-sided adhesive/pad) | --- ### 2. Design Characteristics This heat sink is engineered for versatility and high efficiency in confined spaces. * **Fin Style (Straight Fin):** The "Straight Fin" design is optimized for high-performance airflow environments. It allows air to pass through the fins with minimal resistance, effectively carrying heat away from the semiconductor. * **The Push-Pin Mechanism:** Instead of using messy thermal glues, this part uses pre-assembled push-pins and springs. This ensures even pressure across the chip, which improves thermal transfer and makes assembly repeatable on a production line. * **Material Choice:** The aluminum body provides a lightweight solution with high thermal conductivity, while the blue anodized finish provides corrosion resistance and increased surface emissivity. --- ### 3. Electronic Application The ATS-17B-75-C3-R0 is typically used to cool the following types of electronic components: 1. **BGA (Ball Grid Array) Packages:** Common in high-speed processors or FPGAs. 2. **Power MOSFETs:** When grouped together, these heat sinks can manage the thermal load of power conversion circuits. 3. **Network Processors:** Often found in routers and switches where constant airflow is present. --- ### 4. Thermal Performance Overview Thermal resistance is critical. As the air velocity (Measured in Linear Feet per Minute - LFM) increases, the cooling efficiency improves: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 15.20 | | 300 (Unducted) | 4.00 | | 500 (Unducted) | 3.10 | ---