The **ATS-17B-07-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These parts are designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 12.7mm | | **Thermal Resistance** | 17.00°C/W (Unducted) | | **Airflow Pattern** | Straight Fin | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's geometry and material properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **17B**: Specific series and pin configuration. * **07**: Fin pitch/height designation. * **C2**: Material and Thermal Interface Material (TIM). Usually signifies aluminum with **T766** phase-change material or high-performance thermal grease. * **R0**: RoHS compliance/Revision status. --- ### 3. Key Electronic Functions #### Heat Dissipation The primary electronic role of this part is to increase the surface area of a heat-generating component. By attaching this to an Integrated Circuit (IC), the thermal energy is transferred from the silicon die to the aluminum fins, where it is carried away by airflow (convection). #### Thermal Interface Material (TIM) The "C2" suffix indicates that the part comes pre-applied with a thermal interface. This is crucial in electronics to fill microscopic air gaps between the component and the heatsink, ensuring maximum thermal conductivity. #### Mechanical Integration Unlike adhesive-based heatsinks, the **push-pin** mechanism uses a spring-loaded system. This provides: * **Consistent Pressure:** Ensures the TIM is compressed evenly. * **Reliability:** Resistant to vibration and shock compared to thermal tape. * **Non-permanent:** Can be removed for maintenance without damaging the PCB. --- ### 4. Typical Applications * **Embedded Systems:** Cooling microprocessors in industrial controllers. * **Networking Hardware:** Heat management for switches and routers. * **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules).