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  • ATS-16F-96-C2-R0

  • AI
    The **ATS-16F-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 0.82°C/W (at 200 LFM) | | **Hardware included** | Brass Springs and Plastic Pins | --- ### 2. Key Design Features The "96-C2-R0" configuration indicates specific engineering choices for electronic cooling: * **Spread Fin Geometry:** The fins are designed with a tapered base and wider tops. This reduces pressure drop and increases the surface area for airflow, making it highly efficient for forced convection environments. * **pushPIN™ Attachment:** This system replaces traditional adhesive tapes or thermal epoxies. It ensures consistent pressure on the electronic chip, which optimizes the thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** The "C2" suffix typically denotes that the part comes with **T766** pre-applied thermal phase-change material, which fills microscopic air gaps between the component and the heat sink. --- ### 3. Electronic Application This part is commonly used in high-power electronic circuits to prevent thermal throttling or component failure. ```yaml Typical_Use_Cases: - Enterprise Networking (Switches/Routers) - Industrial Power Supplies - Embedded Computing Boards - High-Speed Signal Processing Units ``` --- ### 4. Part Number Decoder Understanding the "ATS-16F-96-C2-R0" nomenclature: * **ATS:** Brand (Advanced Thermal Solutions). * **16:** Part family/series identifier. * **F:** Attachment type (pushPIN™). * **96:** Specific fin pattern/geometric profile. * **C2:** Phase-change thermal interface material (T766). * **R0:** Revision/Standard packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the rated 0.82°C/W thermal resistance?
    • ⤷ How does the pushPIN attachment compare to standard clip-on heat sinks?
    • ⤷ What are the dimensions of the PCB mounting holes required for this part?