ATS-16F-96-C2-R0
AI

The **ATS-16F-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Black Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimension (L x W)** | 45mm x 45mm |
| **Height** | 25mm |
| **Thermal Resistance** | 0.82°C/W (at 200 LFM) |
| **Hardware included** | Brass Springs and Plastic Pins |
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### 2. Key Design Features
The "96-C2-R0" configuration indicates specific engineering choices for electronic cooling:
* **Spread Fin Geometry:** The fins are designed with a tapered base and wider tops. This reduces pressure drop and increases the surface area for airflow, making it highly efficient for forced convection environments.
* **pushPIN™ Attachment:** This system replaces traditional adhesive tapes or thermal epoxies. It ensures consistent pressure on the electronic chip, which optimizes the thermal interface material (TIM) performance.
* **Thermal Interface Material (TIM):** The "C2" suffix typically denotes that the part comes with **T766** pre-applied thermal phase-change material, which fills microscopic air gaps between the component and the heat sink.
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### 3. Electronic Application
This part is commonly used in high-power electronic circuits to prevent thermal throttling or component failure.
```yaml
Typical_Use_Cases:
- Enterprise Networking (Switches/Routers)
- Industrial Power Supplies
- Embedded Computing Boards
- High-Speed Signal Processing Units
```
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### 4. Part Number Decoder
Understanding the "ATS-16F-96-C2-R0" nomenclature:
* **ATS:** Brand (Advanced Thermal Solutions).
* **16:** Part family/series identifier.
* **F:** Attachment type (pushPIN™).
* **96:** Specific fin pattern/geometric profile.
* **C2:** Phase-change thermal interface material (T766).
* **R0:** Revision/Standard packaging code.
- ⤷
What are the airflow requirements to achieve the rated 0.82°C/W thermal resistance?
- ⤷ How does the pushPIN attachment compare to standard clip-on heat sinks?
- ⤷ What are the dimensions of the PCB mounting holes required for this part?