The **ATS-16F-95-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. This component belongs to their "blueICE" or "pushPIN" heat sink line, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The following table breaks down the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16F-95-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimension (Length/Width)** | 40.00 mm x 40.00 mm | | **Height (Profile)** | 25.00 mm | | **Fin Style** | Fine Pitch (Straight Fin) | --- ### 2. Breakdown of the Part Number The alphanumeric string provides specific details about the configuration: * **ATS-16**: Refers to the specific series/family of heat sinks. * **F**: Indicates the fin density (typically "Fine" pitch). * **95**: Refers to the specific design footprint or internal dimensioning. * **C2**: Specifies the material and finish (Aluminum with a Blue Anodized coating). * **R0**: Indicates the revision level or specific packaging/attachment variation. --- ### 3. Key Electronic Functions While the heat sink itself is passive, it performs critical roles in an electronic assembly: 1. **Thermal Management:** It increases the surface area of the heat-generating component (e.g., a BGA chip), allowing for faster heat dissipation into the surrounding air via convection. 2. **Thermal Interface:** The **T766 TIM** pre-applied to the base fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. 3. **Mechanical Attachment:** The use of **Push-Pins** ensures consistent pressure across the chip surface. This prevents "hot spots" caused by uneven contact and protects the delicate solder balls under BGA packages from mechanical stress. --- ### 4. Implementation Example In a PCB design, you would define the hole patterns for the push-pins around the component. ```markdown PCB Layout Requirements: - Hole Diameter: 3.0mm to 3.2mm (standard for push-pins) - Hole Spacing: Matches the 40mm x 40mm footprint alignment - Keep-out Zone: Ensure no tall capacitors are within the 40mm perimeter ```