The **ATS-16F-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific data regarding its dimensions, performance, and material properties: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Flowing)** | 1.64 °C/W @ 1.0 m/s (200 LFM) | | **Thermal Resistance (Static)** | 4.11 °C/W (Natural Convection) | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision engineering ensures the heat sink fits standard PCB layouts: | Dimension | Value (mm) | Description | | :--- | :--- | :--- | | **Length (A)** | 40.00 mm | Base length | | **Width (B)** | 40.00 mm | Base width | | **Height (C)** | 15.00 mm | Total height from base to fin tip | | **Pitch (E)** | 33.00 mm | Distance between mounting holes (X-axis) | | **Pitch (F)** | 33.00 mm | Distance between mounting holes (Y-axis) | --- ### 3. Key Features and Usage * **Push-Pin Mounting:** This model uses a push-pin mechanism with a compression spring. This provides the necessary pressure to ensure optimal contact between the component and the heat sink without requiring screws. * **High-Performance Fin Design:** The "92" series features a square fin pattern designed to allow airflow from any direction, making it ideal for systems with complex or shifting air currents. * **Blue Anodized Coating:** The surface is treated with a blue anodized finish, which not only provides corrosion resistance but also slightly increases thermal emissivity. * **Pre-Applied TIM:** It comes with **T766** thermal interface material already applied to the base, reducing assembly time and ensuring a consistent thermal bond. ### 4. Application Areas * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and high-speed processors. ---