The **ATS-16F-91-C2-R0** is a high-performance thermal management component specifically designed for cooling electronic integrated circuits (ICs). It belongs to the **Advanced Thermal Solutions (ATS)** "maxiFLOW" product line. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Heat Sink Type** | pushPIN™ Heat Sink Assembly | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 21.97°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Configuration** | Fine Pitch (maximizes surface area) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### 2. Core Electronic Components #### A. The Heat Sink Body The body is constructed from extruded aluminum. Its primary function is to increase the surface area of a heat-generating electronic component (like a CPU, FPGA, or GPU), allowing the ambient air to carry heat away more efficiently. #### B. pushPIN™ Mounting System Instead of using messy adhesives or permanent epoxy, this part uses a mechanical **pushPIN™** system. * **Springs:** Provides consistent pressure (clamping force) across the interface. * **Pins:** Usually made of brass or plastic, these snap into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number refers to the **T766** thermal interface material. This is a thin layer applied to the base of the heat sink. It fills microscopic air gaps between the chip and the metal to ensure maximum heat transfer. --- ### 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Resistance (Unducted) | Resistance (Ducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 21.97 °C/W | 3.63 °C/W | | 300 | 1.5 | 5.33 °C/W | 1.93 °C/W | | 500 | 2.5 | 3.01 °C/W | 1.49 °C/W | --- ### 4. Typical Applications * **Telecommunications:** Cooling high-speed signal processors. * **Embedded Systems:** Protecting microcontrollers in industrial enclosures. * **Power Supplies:** Managing heat in voltage regulators and MOSFETs.