The **ATS-16F-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### ## Technical Specifications Below are the key electronic and physical characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 24.11 °C/W (@ 100 LFM) | | **Mounting Type** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Attachment Interface** | T766 (Pre-applied Thermal Interface Material) | --- ### ## Component Breakdown #### 1. Pin Fin Design The "Pin Fin" geometry is superior to straight fins in environments where the airflow direction is unpredictable or non-linear. The pins increase the surface area and create turbulence, which enhances heat transfer away from the electronic package. #### 2. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material or high-performance thermal pad that fills microscopic air gaps between the heat sink and the electronic chip, ensuring low thermal resistance. #### 3. pushPIN™ Attachment System Instead of using messy adhesives or complicated screws, this part uses a spring-loaded push-pin system. * **Mechanical Stability:** Provides consistent pressure to ensure the TIM stays in contact with the heat source. * **Ease of Assembly:** Simplifies the PCB manufacturing process. #### 4. Thermal Performance The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** 24.11 °C/W * **High Airflow (700 LFM):** 2.25 °C/W --- ### ## Typical Use Cases * **Voltage Regulator Modules (VRMs):** Cooling power delivery circuits on motherboards. * **Embedded Systems:** Small form factor PCs where space is limited (10mm height). * **Networking Hardware:** Cooling ASICs in routers and switches.