ATS-16F-84-C2-R0
AI

The **ATS-16F-84-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs on printed circuit boards (PCBs).
---
### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-16F-84-C2-R0 |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push Pins (with Springs) |
| **Dimension (L x W)** | 30mm x 30mm |
| **Height** | 35mm |
| **Fin Type** | XCUT (Straight Fins with Cross-cut) |
| **Thermal Resistance** | 2.99 °C/W (@ 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Design Characteristics
* **XCUT Fin Geometry:** The fins are designed with cross-cuts. This allows for multi-directional airflow, making it more efficient in systems where the direction of the cooling air might change or be turbulent.
* **Push Pin Attachment:** This model uses a plastic or brass push pin with a built-in spring.
* **Benefit:** Ensures consistent pressure on the component for maximum heat transfer.
* **Requirement:** The PCB must have pre-drilled holes to accommodate the pins.
* **Material Finish:** The blue anodized aluminum coating not only provides a professional aesthetic but also adds a layer of protection against corrosion and slightly improves radiant heat transfer.
---
### 3. Thermal Performance (Estimated)
The efficiency of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM).
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 2.99 |
| 200 | 1.0 | 2.01 |
| 300 | 1.5 | 1.76 |
| 400 | 2.0 | 1.62 |
---
### 4. Typical Applications
* **Integrated Circuits (ICs):** Cooling high-speed processors or FPGAs.
* **Networking Gear:** Used in routers and switches.
* **Power Electronics:** Dissipating heat from voltage regulators or motor drivers.
---
- ⤷
What are the PCB hole size requirements for this push-pin heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a low-profile version of the ATS-16F series for slim devices?