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  • ATS-16F-84-C2-R0

  • AI
    The **ATS-16F-84-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power ASICs on printed circuit boards (PCBs). --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-16F-84-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pins (with Springs) | | **Dimension (L x W)** | 30mm x 30mm | | **Height** | 35mm | | **Fin Type** | XCUT (Straight Fins with Cross-cut) | | **Thermal Resistance** | 2.99 °C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics * **XCUT Fin Geometry:** The fins are designed with cross-cuts. This allows for multi-directional airflow, making it more efficient in systems where the direction of the cooling air might change or be turbulent. * **Push Pin Attachment:** This model uses a plastic or brass push pin with a built-in spring. * **Benefit:** Ensures consistent pressure on the component for maximum heat transfer. * **Requirement:** The PCB must have pre-drilled holes to accommodate the pins. * **Material Finish:** The blue anodized aluminum coating not only provides a professional aesthetic but also adds a layer of protection against corrosion and slightly improves radiant heat transfer. --- ### 3. Thermal Performance (Estimated) The efficiency of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 2.99 | | 200 | 1.0 | 2.01 | | 300 | 1.5 | 1.76 | | 400 | 2.0 | 1.62 | --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling high-speed processors or FPGAs. * **Networking Gear:** Used in routers and switches. * **Power Electronics:** Dissipating heat from voltage regulators or motor drivers. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole size requirements for this push-pin heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Is there a low-profile version of the ATS-16F series for slim devices?