The **ATS-16F-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed for applications requiring high heat dissipation in space-constrained environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16F-80-C2-R0 | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance** | 7.03°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Design Breakdown #### A. The maxiFLOW™ Geometry The "F" in the part number indicates the use of ATS’s signature **maxiFLOW™** fin geometry. Unlike standard square fins, these are tapered to: * Increase surface area for convection. * Reduce pressure drop across the heat sink. * Improve airflow into the fin field, which is critical for dense PCB layouts. #### B. The pushPIN™ Attachment The unit utilizes the **pushPIN™** assembly system. This electronic mounting hardware provides: 1. **Uniform Pressure:** Ensures a consistent interface between the heat sink and the heat-generating component (e.g., a CPU, FPGA, or GPU). 2. **Tool-less Installation:** The pre-assembled springs and pins allow for fast assembly. 3. **Secure Fit:** Prevents the heat sink from shifting during vibration or shock. #### C. Thermal Interface Material (TIM) The **-R0** suffix typically indicates that the part comes pre-applied with a high-performance thermal interface material (like Phase Change Material or Thermal Grease) to bridge the air gap between the component and the aluminum base. --- ### 3. Common Applications This specific heat sink size (30x30mm) is commonly used for: * **Networking Hardware:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-current power supplies. * **ASICs/FPGAs:** Medium-power chips that require active or passive cooling. ---