The **ATS-16F-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *pushPIN™* series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Thermal Resistance** | 2.63 °C/W (@ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### 2. Design and Construction The design of this heat sink is optimized for space-constrained environments requiring high vertical clearance: * **Fin Style:** It utilizes a **Square-Fin** (Cross-cut) design. This allows for multi-directional airflow, making it versatile for different PCB layouts where airflow direction might not be strictly linear. * **Thermal Interface (TIM):** The unit comes with **T766** pre-applied. This is a high-performance thermal pad/paste that ensures minimal air gaps between the heat sink base and the component surface. * **Push-Pin Mechanism:** Instead of using adhesive tape or screws, it uses a spring-loaded push-pin system. This provides consistent pressure (clamping force) and allows for easy installation and removal without damaging the PCB. --- ### 3. Thermal Performance Profile Thermal resistance is critical for determining if this part can keep a processor or MOSFET within safe operating temperatures. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.63 | | 200 (1.0 m/s) | 1.99 | | 300 (1.5 m/s) | 1.72 | | 400 (2.0 m/s) | 1.55 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small-form-factor CPUs or SoCs. * **Telecommunications:** Signal processing units and networking switches. * **Power Electronics:** Dissipating heat from high-speed transistors. * **Industrial Controls:** Ensuring reliability in 24/7 operating environments.