ATS-16F-75-C3-R0
AI

## Technical Overview: ATS-16F-75-C3-R0
The **ATS-16F-75-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Key Technical Specifications
| Parameter | Value / Description |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-16F-75-C3-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Fin Type** | Straight Fin |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 15.02 °C/W (Unducted Flow @ 100 LFM) |
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### 2. Physical Dimensions
Precision sizing is critical for ensuring compatibility with the PCB layout and surrounding components.
| Dimension | Measurement |
| :--- | :--- |
| **Width (X)** | 25.00 mm |
| **Length (Y)** | 25.00 mm |
| **Height (Z)** | 20.00 mm |
| **Hole Spacing** | 30.00 mm |
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### 3. Component Features and Benefits
1. **High-Performance Thermal Interface Material (TIM):**
The unit typically comes pre-assembled with **T412** thermal interface material, which ensures a high-conductivity path between the electronic component and the heat sink.
2. **PushPIN™ Mounting System:**
It uses a flexible attachment system that allows for easy installation and consistent pressure. The springs provide enough force to maintain contact without damaging the PCB.
3. **Straight Fin Design:**
Optimized for airflow in a single direction. The "C3" designation often refers to specific fin density/pitch optimized for medium-to-high velocity airflow.
4. **Material Durability:**
The use of **Aluminum 6063** provides an excellent balance of thermal conductivity and weight, while the blue anodized coating protects against corrosion.
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### 4. Application Example
This part is commonly used in:
* **Networking Hardware:** Routers, switches, and bridges.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
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- ⤷
What are the alternative thermal interface materials (TIM) available for this series?
- ⤷ How does the thermal resistance change at higher air flow velocities (e.g.
- ⤷ 500 LFM)?
- ⤷ Is this heat sink compatible with standard BGA components?