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  • ATS-16F-75-C3-R0

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    ## Technical Overview: ATS-16F-75-C3-R0 The **ATS-16F-75-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Key Technical Specifications | Parameter | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16F-75-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 15.02 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring compatibility with the PCB layout and surrounding components. | Dimension | Measurement | | :--- | :--- | | **Width (X)** | 25.00 mm | | **Length (Y)** | 25.00 mm | | **Height (Z)** | 20.00 mm | | **Hole Spacing** | 30.00 mm | --- ### 3. Component Features and Benefits 1. **High-Performance Thermal Interface Material (TIM):** The unit typically comes pre-assembled with **T412** thermal interface material, which ensures a high-conductivity path between the electronic component and the heat sink. 2. **PushPIN™ Mounting System:** It uses a flexible attachment system that allows for easy installation and consistent pressure. The springs provide enough force to maintain contact without damaging the PCB. 3. **Straight Fin Design:** Optimized for airflow in a single direction. The "C3" designation often refers to specific fin density/pitch optimized for medium-to-high velocity airflow. 4. **Material Durability:** The use of **Aluminum 6063** provides an excellent balance of thermal conductivity and weight, while the blue anodized coating protects against corrosion. --- ### 4. Application Example This part is commonly used in: * **Networking Hardware:** Routers, switches, and bridges. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What are the alternative thermal interface materials (TIM) available for this series?
    • ⤷ How does the thermal resistance change at higher air flow velocities (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is this heat sink compatible with standard BGA components?