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  • ATS-16F-69-C2-R0

  • AI
    The part number **ATS-16F-69-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature. Here is the breakdown of its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Thermal Resistance (Flowing Air)** | ~1.15°C/W @ 200 LFM | | **REACH/RoHS Status** | Compliant | --- ### 2. Breakdown of the Part Number Advanced Thermal Solutions uses a structured coding system to define the part's attributes: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **16** | Series | Push-pin attachment series | | **F** | Fin Type | Fine pitch / Specific fin geometry | | **69** | Model ID | Specific footprint and height configuration | | **C2** | Material/Finish | Aluminum with Blue Anodized finish | | **R0** | Revision | Standard production version | --- ### 3. Key Electronic Functions While a heatsink is a mechanical component, it is vital for the electronic stability of a circuit: * **Thermal Management:** It prevents "Thermal Throttling" in processors by dissipating heat into the ambient air. * **Component Longevity:** By keeping junction temperatures low, it reduces the rate of Arrhenius-based degradation in semiconductor materials. * **Mechanical Integrity:** The push-pin design ensures consistent pressure across the chip surface, which is critical for the effectiveness of the Thermal Interface Material (TIM). --- ### 4. Implementation Example To use this part in a PCB design, the following considerations are required: ```markdown 1. PCB Hole Pattern: Requires two 3mm diameter holes spaced according to the 45mm footprint. 2. Clearance: Ensure no tall capacitors or inductors are within the 45x45mm "keep-out" zone. 3. Airflow: Orientation of the straight fins should align with the direction of the system fan. ```
    ✨ Follow-up Questions
    • ⤷ What are the specific hole dimensions required on a PCB for the ATS-16 series push-pins?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Is there a version of this heatsink with a different fin height for low-profile enclosures?