The part number **ATS-16F-66-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific model belongs to their *blueICE™* or standard extrusion series, designed for cooling electronic components like CPUs, GPUs, or power modules. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.96 °C/W (Natural Convection) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Thermal Phase Change Material) | --- ## Component Breakdown ### 1. The Heatsink Body The part is made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly improves heat radiation. ### 2. Attachment Mechanism: Push-Pins The **"16F"** in the part number indicates a specific push-pin configuration. * **Ease of Install:** Uses plastic push-pins that snap into pre-drilled holes on the PCB. * **Constant Pressure:** A brass or steel spring ensures even pressure across the component (die), which is critical for efficient heat transfer. ### 3. Thermal Interface Material (TIM) The **"C2"** designation typically refers to the pre-applied thermal material. In this case, it features **T766**, a high-performance phase-change material that melts at operating temperatures to fill microscopic air gaps between the heatsink and the chip. --- ## Performance Characteristics The efficiency of this heatsink depends heavily on the airflow (measured in Linear Feet per Minute - LFM): * **@ 200 LFM:** Thermal resistance drops significantly to approximately **3.43 °C/W**. * **@ 500 LFM:** Thermal resistance drops further to approximately **1.80 °C/W**. ### Applications * **Networking:** Switches and routers. * **Embedded Systems:** Industrial PC processors. * **Power Supplies:** Cooling MOSFETs or Large ICs.