## Electronic Specifications: ATS-16F-55-C2-R0 The **ATS-16F-55-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is specifically designed for high-component density electronic packages. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16F-55-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.39°C/W (at 200 LFM) | | **Dimension (L x W x H)** | 35mm x 35mm x 10mm | | **Flow Direction** | XCUT (Cross-Cut) | --- ### 2. Physical Design & Construction * **XCUT (Cross-Cut) Pattern:** The fin design is cross-cut, which allows for omnidirectional airflow. This makes it ideal for PCBs where the direction of the airflow from fans might be unpredictable or multi-directional. * **Low Profile:** With a height of only 10mm, this part is intended for systems with tight vertical clearances (e.g., 1U servers or mobile devices). * **Blue Anodized Coating:** The blue anodizing is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how effectively the part moves heat away from the component. For this model: * **@ 100 LFM (0.5 m/s):** 4.84 °C/W * **@ 200 LFM (1.0 m/s):** 2.39 °C/W * **@ 500 LFM (2.5 m/s):** 1.47 °C/W --- ### 4. Mounting System The **-R0** suffix indicates the specific mounting hardware included: * **Push-Pins:** Uses a plastic push-pin system with a brass spring. * **Hole Pattern:** Requires pre-drilled holes in the PCB. * **TIM (Thermal Interface Material):** Usually comes pre-applied with **T766** high-performance phase-change material or similar, ensuring a low-resistance path between the chip and the aluminum. --- ### 5. Common Applications * **BGA Cooling:** Used for Field Programmable Gate Arrays (FPGAs) and Application Specific Integrated Circuits (ASICs). * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs where passive or semi-passive cooling is required.