The **ATS-16F-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series. --- ### 1. Technical Specifications This component is designed to dissipate heat from integrated circuits (ICs) and other surface-mount components. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16F-48-C2-R0 | | **Heat Sink Type** | Push-pin Heat Sink (Fine Pitch) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 7.59°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 25mm x 25mm x 15mm | | **Fin Pattern** | XC-CUT (Cross-Cut) | --- ### 2. Key Electronic Features #### A. Thermal Performance The "C2" in the part number indicates the thermal interface material (TIM) and performance grade. This unit is optimized for high-density electronic packaging where airflow might be limited. The **cross-cut fin design** allows for multi-directional airflow, which is critical in compact PCB layouts. #### B. Mechanical Attachment (Push-Pin) Unlike adhesive-based heat sinks, the **ATS-16F-48-C2-R0** uses a mechanical push-pin system. * **Spring-Loaded:** Provides consistent pressure (force) on the component to ensure optimal thermal contact. * **Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal cycling, a common failure point in industrial electronics. #### C. Material Properties * **Aluminum 6063:** Provides high thermal conductivity while remaining lightweight. * **Blue Anodized Finish:** Not only aesthetic but also increases surface emissivity and provides corrosion resistance for the metal. --- ### 3. Part Number Breakdown To understand the specific electronic requirements this part fulfills, we can decode the suffix: | Segment | Meaning | | :--- | :--- | | **ATS-16** | Series Identifier | | **F** | Fin Pitch (Fine) | | **48** | Specific Design Reference | | **C2** | T766 Phase Change Thermal Interface Material (TIM) | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Integration Requirements To use this part in a circuit design, the PCB must have: 1. **Mounting Holes:** Two pre-drilled holes spaced according to the 25mm footprint. 2. **Keep-out Zone:** A clear area around the target chip to accommodate the push-pin springs.