## Technical Analysis of ATS-16F-40-C2-R0 The **ATS-16F-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series, characterized by its "push-pin" attachment mechanism. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Top Mount (Cross-Cut) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 14.56°C/W (at 1.0 m/s airflow) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring no interference with surrounding components. * **Length (Dimension A):** 45.00 mm * **Width (Dimension B):** 45.00 mm * **Height (Dimension C):** 15.00 mm * **Pitch (Dimension E):** 38.00 mm (Distance between holes) * **Pitch (Dimension F):** 38.00 mm --- ### 3. Thermal Performance Data Performance varies based on the airflow (velocity) within the electronic enclosure. | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 14.56 | | 400 | 2.0 | 7.30 | | 600 | 3.0 | 5.20 | | 800 | 4.0 | 4.10 | --- ### 4. Component Features * **Cross-Cut Design:** The fin structure is cut in both directions, allowing for multi-directional airflow. This is ideal for systems where the air direction might be unpredictable. * **Push-Pin Attachment:** Features a flexible, spring-loaded plastic push-pin. This ensures a secure fit with consistent pressure on the component (CPU, GPU, or FPGA), improving thermal transfer. * **Pre-Applied TIM:** These units typically come with **Advanced Thermal Interface Material (TIM)** pre-applied to the base to reduce assembly time and optimize thermal conductivity. * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. --- ### 5. Application Use Cases * **Embedded Systems:** For cooling SOCs (System on Chips). * **Telecommunications:** Used on high-speed networking line cards. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.