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  • ATS-16F-36-C2-R0

  • AI
    The **ATS-16F-36-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions directly to a Printed Circuit Board (PCB). --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.48°C/W @ 200 LFM (Linear Feet per Minute) | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 15.00mm | | **Attachment Method** | Push Pin (Plastic) | | **Interface Material** | T766 (Thermal Interface Material) | --- ## 2. Key Component Features ### A. Fin Design This part utilizes a **Fine Pitch Fin** pattern. This maximizes the surface area for heat dissipation, making it ideal for high-density electronic assemblies where airflow might be slightly restricted. ### B. Attachment System (pushPIN™) Instead of relying on adhesives (which can fail over time) or complex screw assemblies, this part uses: * **Plastic Push Pins:** These snap through pre-drilled holes in the PCB. * **Compression Springs:** These ensure a consistent, calculated pressure between the heat sink and the component (CPU/GPU/FPGA), which is critical for optimal thermal transfer. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This eliminates the need for manual application of thermal paste, ensuring a uniform layer that bridges the microscopic air gaps between the component and the heat sink. --- ## 3. Typical Applications The ATS-16F-36-C2-R0 is commonly used to cool small to medium-sized integrated circuits (ICs) such as: * **FPGAs & ASICs:** Used in telecommunications and data processing. * **Embedded Systems:** Industrial controllers that generate significant heat in small enclosures. * **Network Switches:** Providing thermal management for high-speed processing chips. --- ## 4. Ordering Nomenclature Breakdown The part number can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **16F:** Part of the pushPIN™ series. * **36:** Dimensions (approx. 36mm). * **C2:** Material/Color code (typically relates to the Blue Anodize finish). * **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the push pins in this model?
    • ⤷ How does the T766 interface material compare to standard thermal grease?
    • ⤷ What is the maximum TDP (Thermal Design Power) this heat sink can safely manage?