ATS-16F-36-C2-R0
AI

The **ATS-16F-36-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions directly to a Printed Circuit Board (PCB).
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 1.48°C/W @ 200 LFM (Linear Feet per Minute) |
| **Dimensions (L x W)** | 36.83mm x 36.83mm |
| **Height** | 15.00mm |
| **Attachment Method** | Push Pin (Plastic) |
| **Interface Material** | T766 (Thermal Interface Material) |
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## 2. Key Component Features
### A. Fin Design
This part utilizes a **Fine Pitch Fin** pattern. This maximizes the surface area for heat dissipation, making it ideal for high-density electronic assemblies where airflow might be slightly restricted.
### B. Attachment System (pushPIN™)
Instead of relying on adhesives (which can fail over time) or complex screw assemblies, this part uses:
* **Plastic Push Pins:** These snap through pre-drilled holes in the PCB.
* **Compression Springs:** These ensure a consistent, calculated pressure between the heat sink and the component (CPU/GPU/FPGA), which is critical for optimal thermal transfer.
### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766**. This eliminates the need for manual application of thermal paste, ensuring a uniform layer that bridges the microscopic air gaps between the component and the heat sink.
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## 3. Typical Applications
The ATS-16F-36-C2-R0 is commonly used to cool small to medium-sized integrated circuits (ICs) such as:
* **FPGAs & ASICs:** Used in telecommunications and data processing.
* **Embedded Systems:** Industrial controllers that generate significant heat in small enclosures.
* **Network Switches:** Providing thermal management for high-speed processing chips.
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## 4. Ordering Nomenclature Breakdown
The part number can be decoded as follows:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **16F:** Part of the pushPIN™ series.
* **36:** Dimensions (approx. 36mm).
* **C2:** Material/Color code (typically relates to the Blue Anodize finish).
* **R0:** Revision/Packaging code.
- ⤷
What are the PCB hole diameter requirements for the push pins in this model?
- ⤷ How does the T766 interface material compare to standard thermal grease?
- ⤷ What is the maximum TDP (Thermal Design Power) this heat sink can safely manage?