The **ATS-16F-33-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** "push-pin" style heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Top Mount (Square) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 1.80°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 36.83mm x 36.83mm x 17.78mm | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Part Number Breakdown The nomenclature for ATS parts follows a specific logic: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16**: Series number (Size/Attachment style). * **F**: Fin pattern/density designation. * **33**: Height/Dimension code. * **C2**: Material and Finish (Aluminum with Blue Anodized finish). * **R0**: Versioning/Revision code. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical component, it serves critical roles in an electronic assembly: * **Thermal Dissipation:** It increases the surface area of the component (CPU, FPGA, or GPU), allowing heat to transfer to the ambient air more efficiently. * **Heat Pipe compatibility:** The "push-pin" design ensures a precise, high-pressure fit against the chip, reducing the thermal contact resistance. * **Standardized Mounting:** The holes are spaced to fit standard PCB layouts, ensuring compatibility with high-density circuit boards. * **Pre-Applied TIM:** The "T766" thermal interface material ensures that there are no air gaps between the component and the heat sink, maximizing heat transfer. --- ### 4. Comparison of Thermal Resistance (Air Flow) Thermal performance changes based on the Linear Feet per Minute (LFM) of airflow: | Air Velocity (LFM) | 200 | 400 | 600 | 800 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 1.80 | 1.15 | 0.95 | 0.82 | ---