The **ATS-16F-27-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed for cooling integrated circuits (ICs) and other electronic components on a PCB. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below is the breakdown of its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Push-pin Attachment) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 12.24°C/W (at 1.0 m/s airflow) | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | --- ### 2. Functional Components This part consists of three primary electronic/mechanical sub-parts: 1. **Heat Sink Body:** A square aluminum block with a 45mm footprint. The straight fins increase the surface area to dissipate heat into the surrounding air via convection. 2. **Push-Pins:** These are precision-machined brass pins that pass through pre-drilled holes in the PCB. They provide a secure mechanical connection without the need for adhesive. 3. **Compression Springs:** These are located on the push-pins to ensure constant downward pressure (TIM - Thermal Interface Material pressure). This minimizes air gaps between the heat sink and the chip. --- ### 3. Thermal Performance Table Thermal resistance indicates how effectively the part moves heat away from the electronic component. Lower values are better at higher airflows. | Air Velocity (LFM) | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 12.24 | | 400 | 2.0 | 4.67 | | 600 | 3.0 | 3.16 | | 800 | 4.0 | 2.53 | --- ### 4. Application and Installation * **Target Components:** Used for BGA (Ball Grid Array) chips, CPUs, and GPUs in telecommunications and networking equipment. * **Attachment:** Requires two 3mm holes in the PCB, spaced according to the 38mm hole pattern of this specific model. * **Thermal Interface:** This part is typically used with a **Thermal Pad** or **Thermal Paste** (pre-applied in many "C2" configurations) to bridge the microscopic gaps between the chip surface and the aluminum.