ATS-16F-23-C2-R0
AI

The part number **ATS-16F-23-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific component is part of their "pushPIN™" thermal management line, designed for cooling electronic components like CPUs, GPUs, or high-power chipsets.
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## 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-16F-23-C2-R0 |
| **Heat Sink Type** | pushPIN™ HS |
| **Material** | Aluminum (Blue Anodized) |
| **Fin Configuration** | Fine Pitch (Cross-cut) |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 12.00 °C/W (Unducted) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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## 2. Dimensional Details
The physical dimensions are critical for ensuring fitment on a PCB (Printed Circuit Board).
* **Length (A):** 60.00 mm
* **Width (B):** 60.00 mm
* **Height (C):** 15.00 mm
* **Pitch (E):** 53.00 mm (Distance between mounting holes)
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## 3. Key Electronic Component Features
### A. pushPIN™ Mounting System
This heatsink uses a specialized spring-loaded push-pin mechanism. This ensures:
* **Consistent Pressure:** Provides a precise amount of force (load) to the electronic chip to optimize heat transfer.
* **Ease of Assembly:** Quick installation without the need for complex mounting brackets.
### B. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied. This is a high-performance thermal grease/pad that fills the microscopic air gaps between the chip surface and the heatsink base, significantly lowering thermal resistance.
### C. Fine-Pitch Fin Design
The fin structure is optimized for high-performance cooling. The "Fine Pitch" design provides a larger surface area for heat dissipation, making it suitable for environments with high airflow (ducted or fan-assisted).
### D. Blue Anodized Finish
The surface is treated with a blue anodized coating. This is not just for aesthetics; it provides:
* Corrosion resistance.
* Increased surface emissivity for better radiant heat loss.
* Electrical insulation (to prevent short circuits if it accidentally touches nearby components).
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## 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **16** | Series / Design Category |
| **F** | Attachment Type (pushPIN™) |
| **23** | Specific Die/Footprint size |
| **C2** | Height and Fin density code |
| **R0** | Material/Finish (Aluminum / Blue Anodized) |
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- ⤷
What are the compatible push-pin materials for this heatsink?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is this heatsink suitable for passive cooling without a fan?