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  • ATS-16F-23-C2-R0

  • AI
    The part number **ATS-16F-23-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific component is part of their "pushPIN™" thermal management line, designed for cooling electronic components like CPUs, GPUs, or high-power chipsets. --- ## 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16F-23-C2-R0 | | **Heat Sink Type** | pushPIN™ HS | | **Material** | Aluminum (Blue Anodized) | | **Fin Configuration** | Fine Pitch (Cross-cut) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 12.00 °C/W (Unducted) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Dimensional Details The physical dimensions are critical for ensuring fitment on a PCB (Printed Circuit Board). * **Length (A):** 60.00 mm * **Width (B):** 60.00 mm * **Height (C):** 15.00 mm * **Pitch (E):** 53.00 mm (Distance between mounting holes) --- ## 3. Key Electronic Component Features ### A. pushPIN™ Mounting System This heatsink uses a specialized spring-loaded push-pin mechanism. This ensures: * **Consistent Pressure:** Provides a precise amount of force (load) to the electronic chip to optimize heat transfer. * **Ease of Assembly:** Quick installation without the need for complex mounting brackets. ### B. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance thermal grease/pad that fills the microscopic air gaps between the chip surface and the heatsink base, significantly lowering thermal resistance. ### C. Fine-Pitch Fin Design The fin structure is optimized for high-performance cooling. The "Fine Pitch" design provides a larger surface area for heat dissipation, making it suitable for environments with high airflow (ducted or fan-assisted). ### D. Blue Anodized Finish The surface is treated with a blue anodized coating. This is not just for aesthetics; it provides: * Corrosion resistance. * Increased surface emissivity for better radiant heat loss. * Electrical insulation (to prevent short circuits if it accidentally touches nearby components). --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **16** | Series / Design Category | | **F** | Attachment Type (pushPIN™) | | **23** | Specific Die/Footprint size | | **C2** | Height and Fin density code | | **R0** | Material/Finish (Aluminum / Blue Anodized) | ---
    ✨ Follow-up Questions
    • ⤷ What are the compatible push-pin materials for this heatsink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Is this heatsink suitable for passive cooling without a fan?