The **ATS-16F-183-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like BGA, FPGA, and processors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (with 47.0mm pitch) | | **Dimensions** | 40.00mm x 40.00mm | | **Height (Fin)** | 20.00mm | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 5.37°C/W (at 100 LFM) to 1.50°C/W (at 700 LFM) | | **Fin Pattern** | Cross-Cut | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment This system uses a spring-loaded push-pin mechanism. In electronic PCB design, this ensures: * **Constant Pressure:** Prevents damage to delicate silicon dies by maintaining even force. * **Secure Mounting:** High vibration resistance for industrial or mobile electronics. * **Ease of Assembly:** Quick installation through pre-drilled holes in the PCB. ### B. Material & Surface Treatment * **AL6063 Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides electrical insulation to the surface and protects against corrosion, which is critical in high-density electronic environments. ### C. Thermal Interface Material (TIM) The "R0" designation typically implies the inclusion of a high-performance thermal interface (such as **T766**), which is the medium that bridges the microscopic air gaps between the chip surface and the heat sink base. --- ## 3. Application Use Cases This specific part is frequently found in the following electronic sectors: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PC boards and controllers. 3. **Power Electronics:** Cooling MOSFET arrays or power converters. 4. **Computing:** GPU or FPGA cooling on daughterboards. --- ## 4. Part Number Breakdown ```text ATS - 16 F - 183 - C2 - R0 | | | | | | | | | +-- Thermal Interface Material | | | +------- Fin Pitch/Type & Material | | +-------------- Sequence Number (Specific Dimensions) | +--------------------- Fin Style (F = Fine) +--------------------------- Manufacturer Prefix ```