The part number **ATS-16F-18-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, specifically designed for high-density electronic cooling. --- ### 1. Technical Specifications The part number is an alphanumeric code that describes its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 4.84°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 54mm x 54mm x 15mm | | **Attachment Method** | pushPIN™ | | **Airflow Direction** | Cross-Cut (Omni-directional) | --- ### 2. Breakdown of the Part Number The code is structured to define the product family and specific dimensions: | Segment | Meaning | Detail | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **16** | Product Series | pushPIN™ Heat Sink Series | | **F** | Attachment Type | Fine Pitch / Specific spring type | | **18** | Height | 15mm - 20mm range (Specific designator) | | **C2** | Thermal Material | T766 Phase Change Material / Blue Anodized | | **R0** | Revision/Finish | Standard revision code | --- ### 3. Key Electronic Components & Features While this is a mechanical part, it is critical for the survival of high-power electronic components. * **pushPIN™ Technology:** Uses a flexible attachment system (plastic or brass pins with springs) that provides the precise pressure required for optimal thermal transfer without damaging the PCB. * **maxiFLOW™ Design:** Features a tapered fin structure that increases the surface area for heat dissipation while reducing the "pressure drop" of air flowing through the system. * **Pre-Applied Thermal Interface Material (TIM):** This part usually comes with a pre-applied thermal pad or phase-change material (T766), ensuring low thermal resistance between the chip and the heat sink. * **Omni-directional Airflow:** The "cross-cut" fin design allows air to enter from any direction, making it ideal for enclosures where airflow patterns might be irregular. --- ### 4. Typical Applications This heat sink is commonly used for cooling: * **FPGAs & ASICs:** In networking hardware and data centers. * **Processors (CPUs/GPUs):** In embedded systems or industrial PCs. * **Power Supplies:** High-efficiency DC-DC converters.