The **ATS-16F-155-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*, part of their "blue ICE" high-performance series. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 5.37°C/W (at 100 LFM) | | **Weight** | ~45 grams | --- ## 2. Physical Dimensions Precision measurements are critical for PCB layout and ensuring the heatsink does not interfere with surrounding components. * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 20.00 mm * **Pitch (E):** 45.00 mm (Distance between push-pins) * **Pitch (F):** 45.00 mm --- ## 3. Key Electronic Components & Features ### A. The Fin Design The "F" in the part number indicates a **Fine-Pitch** fin pattern. This increases the surface area available for heat dissipation, making it ideal for high-density electronic assemblies where airflow might be restricted. ### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or tapes, this part uses a **Push-Pin** system: * **Springs:** Ensure constant, high interface pressure for maximum heat transfer. * **Installation:** Requires pre-drilled holes in the PCB. * **Reliability:** Provides a secure mechanical connection that withstands shock and vibration. ### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heatsink comes pre-applied with **ATS-specific thermal interface material**. This is a phase-change material or high-conductivity grease that fills microscopic air gaps between the component (CPU/GPU/FPGA) and the heatsink. --- ## 4. Common Applications This heatsink is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Power Supplies:** Cooling MOSFETs and voltage regulators. 3. **Embedded Systems:** Industrial PCs and automation controllers. 4. **Processors:** Cooling FPGAs (Field Programmable Gate Arrays) or ASICs.