The **ATS-16F-149-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push-pin" series designed for cooling processors and other high-heat surface-mount components. --- ### 1. Technical Specifications The following table details the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimension (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Fin Style** | Fine-Pitch (increases surface area) | | **Thermal Resistance** | 6.21 °C/W (at 100 LFM) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Key Components and Design Understanding the part number involves breaking down its functional electronic/mechanical design: * **Heat Sink Body:** Constructed from high-quality aluminum to provide optimal heat transfer. The **35mm x 35mm** footprint is common for cooling Chipsets, FPGAs, and BGA (Ball Grid Array) packages. * **The "C2" Variation:** This denotes the specific thermal performance and material grade. In the ATS catalog, "C2" typically signifies a specific fin profile designed for high-density airflows. * **Push-Pin Attachment:** Unlike adhesive-based heat sinks, this part uses a mechanical push-pin system. This ensures a consistent pressure (compression) against the chip, which improves thermal conductivity and makes the part reusable. * **Thermal Interface Material (TIM):** The part comes with **T766** pre-applied. This is a "phase-change" or high-performance thermal pad that fills microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases This part is used in environments where electronic components are prone to overheating: 1. **Telecommunications:** Cooling networking processors in routers or switches. 2. **Industrial PCs:** Providing heat dissipation for embedded controllers. 3. **Power Supplies:** Managing thermal loads for voltage regulators. 4. **Automotive:** Cooling sensors or control units in high-temperature environments. --- ### 4. Part Number Breakdown ```text ATS - 16 - F - 149 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Performance/Material Grade | | | +------------ Specific Product ID | | +----------------- Fin Pitch/Style (Fine) | +---------------------- Series ID +---------------------------- Manufacturer (Advanced Thermal Solutions) ```