The **ATS-16F-07-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These components are designed to dissipate heat from integrated circuits (ICs) and other electronic chips to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and mounting style. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Fine Pitch (Cross-cut) | | **Mounting Style** | Push-Pin (Plastic) | | **Thermal Resistance** | ~17.00°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision measurements are critical for ensuring the heatsink fits within the PCB layout and clears surrounding components. | Dimension | Value | | :--- | :--- | | **Width / Length** | 45mm x 45mm | | **Height** | 12mm | | **Hole Spacing** | 38mm (Center to center) | | **Weight** | ~15-20 grams | --- ### 3. Key Electronic Functions 1. **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA or FPGA), allowing airflow to carry away heat more efficiently. 2. **Thermal Interface Material (TIM):** The "R0" suffix usually indicates the inclusion of a pre-applied high-performance thermal interface material, ensuring a low-resistance thermal path between the chip and the aluminum. 3. **Mechanical Stability:** The push-pin mechanism uses a spring-loaded design to provide consistent pressure, which is vital for maintaining the thermal bond during vibrations or thermal expansion. --- ### 4. Application Use Cases * **Networking Gear:** Switches and routers where high-speed processing generates significant heat. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or power transistors. ---