The **ATS-16F-05-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### ## Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm | | **Height** | 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 5.84 °C/W (@ 100 LFM) | | **Fin Pattern** | XC-CUT (Cross-Cut) | --- ### ### Key Electronic Components & Features #### 1. The Heat Sink Body (Thermal Conduction) * **Aluminum Alloy:** Uses 6063 aluminum, which is the industry standard for heat sinks due to its high thermal conductivity and structural integrity. * **Fin Style:** The **XC-CUT** design features fins that are cut both horizontally and vertically. This increases the surface area and allows for multi-directional airflow, making it effective even if the air isn't blowing directly straight through the fins. #### 2. The Mounting System (pushPIN™) * **Push Pins:** The "R0" at the end of the part number signifies the specific mounting hardware. It uses plastic push pins that snap into pre-drilled holes on the PCB (Printed Circuit Board). * **Spring Mechanism:** Each pin is equipped with a compression spring. This ensures a consistent, calibrated **pressure** (Downward Force) against the electronic chip, which is critical for maximizing heat transfer through the Thermal Interface Material (TIM). #### 3. Thermal Interface Material (TIM) * The **"C2"** in the part number indicates the type of thermal material pre-applied to the base of the heat sink. * **Type:** Specifically, C2 refers to **T766 phase-change material** or a high-performance thermal grease. This fills the microscopic air gaps between the chip and the heat sink base to lower thermal resistance. --- ### ### Application Use-Cases This part is typically found in: * **Networking Gear:** Switches and routers where airflow may be turbulent. * **Embedded Systems:** Industrial PCs where vibration resistance is needed (provided by the springs). * **Power Supplies:** Cooling voltage regulators or MOSFETs. ---